In the era of artificial intelligence (AI) and big data analytics, creators and professionals require workstations that can handle vast amounts of data with efficiency. Precisely capturing the trends in AI technology, TEAMGROUP proudly announces that its T-CREATE brand has been honored with Japan's Good Design Award 2024 for the MASTER Ai DDR5 workstation memory module. This product offers a perfect combination of stability and durability, with a single memory capacity of up to 48GB, making it ideally suited for AI-driven creative tasks. Its minimalist design, featuring a discreet logo and all-in-one porous heat dissipation, not only ensures a stable computing environment but also delivers a sleek, professional look. Once again, T-CREATE has demonstrated its prowess in product design and robust R&D capabilities on the global stage.

Founded in 1957, Japan's Good Design Award is one of the four most prestigious and influential design honors, evaluated based on human, industrial, societal, and temporal perspectives. The T-CREATE MASTER Ai DDR5 workstation memory made its global debut at the COMPUTEX TAIPEI earlier this year, attracting considerable media attention. Its performance, large capacity, and stable computing environment essential for AI applications, along with its all-in-one porous heat dissipation design, have earned its recognition from the Good Design Award 2024, further solidifying TEAMGROUP's international standing.

The development team behind the T-CREATE MASTER Ai DDR5 workstation memory utilized cutting-edge manufacturing processes and overclocking technologies. With individual modules reaching up to 48GB and compatibility with workstations featuring up to 8 DIMM slots, the total memory capacity can reach an impressive 384GB. This capability enables professionals to handle large-scale projects, analyze extensive datasets, and run multiple specialized applications swiftly and reliably. The patented IC classification and verification technology^【1】 ensures overclocking stability and long-term durability, creating a high-performance, stable computing environment crucial for AI-intensive workstations. Additionally, the all-in-one porous heat dissipation design ensures effective thermal management, enhancing processing speed while optimizing energy efficiency and minimizing environmental impact. Furthermore, the product's design and manufacturing fully adhere to EU RoHS regulations, underscoring TEAMGROUP's commitment to sustainability, environmental responsibility, and technological innovation.

【1】    U.S. Patent: US11488679. Taiwan Patent: I751093.