The new Spire Thermal-Kit Pro is a high performance kit with quality thermal interface material designed to maximize heat transfer from processors to heat-sink enabling you to get better cooling performance and lower CPU and GPU temperatures.The high viscosity formula efficiently fills invisible surface imperfections to improve contact and thermal conductivity. The supplied 10gram syringe is sufficient for up to 25 to30 heat-sink installations. The supplied cleanser fluid removes all thermal interface residues including silver based compounds and prepares the processor surface for new thermal compound application. Ideal to clean CPU’s, GPU’s, Chipsets and RAM modules. The 125ml bottle Cleanser will last for months to come. Furthermore included a spatula-knife which makes it easy to clean any old residue and evenly apply the new Spire thermal grease.

Brief specifications:
Silicone Compounds 50%
Carbon Compounds 20%
Metal Oxide Compounds 30%
Thermal Conductivity: 1.93 W/m-K
Thermal Impedance: 0.067 C/W
Specific Gravity: 1.7%
Evaporation: 0.001%
Bleed: 0.05%
Dielectric Constant: 5.1A

Main features:
* Durable high quality thermal interface material
* Applicable to CPU, GPU, Memory and chipsets
* Suitable for the newest high wattage processors
* Included spreader makes application easy
* Better contact means better cooling

Product compatibility: Micro processors, Graphic card processors, memory and chipsets. Any device that requires heat-sink contact.

MSRP: USD 19.95 / EURO 14.95

Availability: The Spire Thermal-Kit Pro, item# SP-455/10G is now available from Spire Shenzhen, China as well as our head-office in Maarheeze, The Netherlands.