SMARTi™ UE2p, a radio frequency solution that integrates 3G power amplifiers into radio frequency circuits, has been announced by Intel Corporation. The new system-on-chip (SoC) solution enables a smaller footprint and reduces complexity for developers as well as the associated total cost of ownership.

“The SMARTi™ UE2p will simplify the product development and supply chain logistics with the reduction in component count and system complexity,” said Stefan Wolff, vice president of the Intel Architecture Group and general manager of Multi-Com. “This will allow our customers to introduce lower-cost 3G handsets and support the transition of the machine-to-machine market segment toward 3G-based connected devices to help enable the ‘Internet of things.’”

The SMARTi™ UE2p integrates Intel’s 3G High Speed Packet Access (HSPA) radio frequency transceiver SMARTi™ UE2 and 3G power amplifiers on a single 65nm silicon die. The integration of power management and sensors allows direct connection to the device battery. The SMARTi™ UE2p supports multiple 3G dual band configurations for global operation with the Intel® XMM62xx HSPA slim modem family.

This solution is targeted at new mass market segments such as entry level 3G handsets and machine-to-machine modules. Samples are expected to be provided to select customers beginning in the fourth quarter of 2012. Intel will also continue its strategic collaborations with leading power amplifier vendors for smartphones and tablets.