Micron Technology, Inc. (Nasdaq: MU), one of the world's leading providers of advanced semiconductor solutions, today announced the expansion of Micron's e•MMC (embedded multimedia card) family of products with devices from 2GB to 64GB enabling solutions for the embedded market. The 4.41 solution offers quick system integration and is suitable for both standard and full industrial temperature environments in a wide range of applications such as digital TV, DVD, set-top box, industrial, medical, imaging, routers, and servers, to name a few.

Micron's e•MMC embedded memory combines a high-capacity NAND Flash memory device with a multimedia card controller in a single BGA package. The single-package solution is a great choice for designers who are looking for a fully managed solution to easily integrate into their application. Because Micron manufactures the NAND, the company can offer e•MMC solutions in a variety of densities and options tailoring performance and features to meet the unique needs of embedded applications. In addition, Micron's e•MMC 4.41 compatible-devices are fully compliant with JEDEC industry standards.

"Micron boasts a dedicated organization that is solely focused on embedded customer needs and requirements," said Jeff Bader, vice president of Marketing for the Embedded Solutions Group at Micron. "Adoption of e•MMC is growing in the embedded market; with the introduction of Micron's e•MMC family of products we will greatly enhance our customers' ability to meet today's design requirements quickly and effectively."

What the Industry is Saying

"With the 4.41 revision satisfying the performance and security needs of most device segments, it is considered the most effective way to utilize high-density NAND for many consumer electronics applications, including entry-level smartphones, ereaders, TVs, set-top boxes and portable music players." (Ryan Chien, IHS iSupply, 'e.MMC NAND Flash Memory Remains Viable Despite UFS Entry,' March 28, 2012)

Micron's embedded e•MMC family includes several unique features optimized for the varied needs of embedded and industrial applications. In addition to current JEDEC solutions with 0.5mm ball pitch, Micron offers a 100-ball 1mm ball pitch optimized for low-cost, high reliability board design and manufacturing. Availability of industrial temperature range (-40C to +85C), SLC partitioning, and power loss data protection capability provide a compelling solution for reliable code and data storage needs in embedded systems.

Micron e•MMC Key Features and Benefits

• Adheres to the JEDEC standard, easing the design and validation process
• Offers standard operating and I/O voltages 3.3Vcc (3.3V/1.8 Vccq)
• Provides a wide density range of 2GB-64GB
• Offers standard and extended temperature ranges of -25°C to +85°C and -40C to +85C which is ideal for rugged environments and industrial applications
• Available in 100-Ball 1mm pitch and JEDEC153-Ball, 169-Ball BGA 0.5 mm pitch packages
• Integrated NAND controller removes the burden of managing the NAND from the host controller, compared to a discrete NAND device
• Enhanced features enabled in partitions and user data area (pseudo SLC partitions) provide reliability for code and system data
• Shipped with optimized write performance, customer configurable for advanced data protection against power loss.

Product Availability

Micron's e•MMC 4.41 compatible-devices are sampling now with production scheduled in September 2012.

For more information visit: http://www.micron.com/products/managed-nand/e-mmc